发明授权
- 专利标题： Method of packaging a semiconductor device
- 专利标题（中）： 封装半导体器件的方法
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申请号： US699288申请日： 1996-08-19
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公开(公告)号： US5656549A公开(公告)日： 1997-08-12
- 发明人: Alan H. Woosley , Harold A. Downey, Jr. , Everitt W. Mace
- 申请人： Alan H. Woosley , Harold A. Downey, Jr. , Everitt W. Mace
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： B29C45/14
- IPC分类号： B29C45/14 ; H01L21/00 ; H01L21/56 ; H01L21/60
摘要：
A method of packaging a semiconductor device includes providing a chase (11) with a cavity (12). The cavity (12) has a cavity sidewall (13). A substrate (19) is provided having a substrate sidewall (20) wherein the substrate (19) is positioned in the cavity (12). A space or gap (21) is formed between the substrate sidewall (20) and the cavity sidewall (13). To insulate the gap (21) from mold compound (27), a barrier layer (22) is placed adjacent to the chase (11) and adjacent to the substrate (19) wherein the barrier layer (22) overlays a portion of the space or gap (21). Mold compound (27) is injected over the barrier layer (22), over the portion of the space or gap (21), and toward the substrate (19). The barrier layer (22) is used to prohibit the mold compound (27) from contacting the substrate sidewall (20) and the cavity sidewall (13) when the substrate (19) is being encapsulated.
公开/授权文献
- US5149387A Flush mounting of thin film sensors 公开/授权日：1992-09-22
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