Improved methods for fabricating the ink feed slots in silicon substrate for use in thermal ink-jet print heads is disclosed. One method involves the partial anisotropic etching of an ink feed slot in a silicon substrate for use in aligning the electrical resistive elements on one surface of the substrate. Another embodiment involves laser drilling alignment holes and anisotropically etching the substrate. In both methods, at least one photoresist masking and development step is eliminated thereby reducing fabrication time and alignment difficulties for locating the feed slots relative to the electrical resistance elements and increasing product yield.