发明授权
- 专利标题: Photosensitive resin composition
- 专利标题(中): 感光树脂组合物
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申请号: US517583申请日: 1995-08-22
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公开(公告)号: US5668248A公开(公告)日: 1997-09-16
- 发明人: Hideo Hagiwara , Makoto Kaji , Hiroshi Nishizawa , Kenji Suzuki , Yasunori Kojima
- 申请人: Hideo Hagiwara , Makoto Kaji , Hiroshi Nishizawa , Kenji Suzuki , Yasunori Kojima
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi Chemical Co., Ltd.
- 当前专利权人: Hitachi Chemical Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX4-007467 19920120; JPX4-298560 19921109
- 主分类号: C07C275/40
- IPC分类号: C07C275/40 ; C08G73/06 ; C08G73/10 ; C08G73/16 ; G03F7/038 ; C08G69/26
摘要:
A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
公开/授权文献
- US5057103A Compressive intramedullary nail 公开/授权日:1991-10-15