发明授权
- 专利标题： Light-transmissive resin sealed semiconductor
- 专利标题（中）： 透光树脂密封半导体
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申请号： US429036申请日： 1995-04-26
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公开(公告)号： US5684325A公开(公告)日： 1997-11-04
- 发明人: Ichiro Kataoka , Takahiro Mori , Satoru Yamada , Hidenori Shiotsuka , Ayako Komori
- 申请人： Ichiro Kataoka , Takahiro Mori , Satoru Yamada , Hidenori Shiotsuka , Ayako Komori
- 申请人地址： JPX Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-114115 19940430
- 主分类号： H01L31/04
- IPC分类号： H01L31/04 ; H01L31/042 ; H01L31/048 ; H01L31/20 ; H01L31/0203
摘要：
A light-transmissive resin sealed semiconductor is provided which is sealed at least at a light incident face of a photoelectric transducer with an organic polymer resin layer, which comprises a copolymer of ethylene and an unsaturated fatty acid ester. This light-transmissive resin sealed semiconductor has a surface layer which has high heat resistance, and low hygroscopicity, and does not liberate a free acid even in the presence of moisture. Thereby the semiconductor is prevented from deterioration of performances caused by the drop of the shunt resistance of the photovoltaic element under high humidity environment.
公开/授权文献
- US3950619A Message charge control telephone answering device 公开/授权日：1976-04-13
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