Invention Grant
- Patent Title: Aqueous fluorine-containing polymer dispersion
- Patent Title (中): 含氟聚合物水分散体
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Application No.: US666356Application Date: 1996-06-21
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Publication No.: US5712335APublication Date: 1998-01-27
- Inventor: Nobuhiko Tsuda , Yasushi Yonei , Ryuzi Iwakiri , Katsuhiko Imoto
- Applicant: Nobuhiko Tsuda , Yasushi Yonei , Ryuzi Iwakiri , Katsuhiko Imoto
- Applicant Address: JPX Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JPX Osaka
- Priority: JPX6-258173 19941024
- Main IPC: C08K5/54
- IPC: C08K5/54 ; C08F14/18 ; C08F214/18 ; C08F259/00 ; C08F259/08 ; C08K5/49 ; C08K5/5419 ; C08L27/12 ; C08L83/04 ; C09D127/12 ; C08K9/06 ; C08L27/16
Abstract:
An aqueous dispersion of a fluorine-containing polymer, wherein 1 to 20 parts by weight of solids of an organosilicon compound is admixed on the basis of 100 parts by weight of solids in the fluorine-containing-polymer-dispersed aqueous composition and this aqueous dispersion is useful for a paint capable of forming a coating film which is excellent in adhesion to various base materials, film forming property, weatherability and soil resistance.
Public/Granted literature
- US5131859A Quick disconnect system for circuit board modules Public/Granted day:1992-07-21
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