发明授权
US5712562A Encapsulated transducer with an alignment plug and method of manufacture
失效
具有对准插头和制造方法的封装传感器
- 专利标题: Encapsulated transducer with an alignment plug and method of manufacture
- 专利标题(中): 具有对准插头和制造方法的封装传感器
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申请号: US542532申请日: 1995-10-13
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公开(公告)号: US5712562A公开(公告)日: 1998-01-27
- 发明人: Dave Van Den Berg
- 申请人: Dave Van Den Berg
- 申请人地址: NV Minden
- 专利权人: Bently Nevada Corporation
- 当前专利权人: Bently Nevada Corporation
- 当前专利权人地址: NV Minden
- 主分类号: G01B7/30
- IPC分类号: G01B7/30 ; G01B7/00 ; G01D11/24 ; G01H1/00 ; G01H11/02 ; G01K7/02 ; G01B7/14 ; B29C45/00 ; G01R3/00
摘要:
The encapsulated transducer (10) includes an injection molded encapsulation (20) having a front end (22) and a back end (24). The encapsulation (20) ensconces a sensing element (40) proximate the front end (22) and a portion of a cable (60) which extends from the back end (24). The sensing element or coil (40) is electrically and mechanically connected to the cable (60) by a pair of suitably sized front and rear ferrules (80), (90) secured to a center and coaxial conductor (66), (70) of the associated cable (60) thereby forming a coil and cable assembly (110). At least the rear ferrule (90) includes a shoulder (100) for firmly anchoring the coil and cable assembly (110) within the encapsulation (20). In addition an injection molding process provides the durable encapsulation (20) which bonds with a dielectric (68) of the cable (60) and symmetrically locks the coil and cable assembly (110) therein.
公开/授权文献
- US4518111A Method of fabricating a bi-metal tube 公开/授权日:1985-05-21
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