发明授权
- 专利标题： Method of producing a box-shaped circuit board
- 专利标题（中）： 制造盒形电路板的方法
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申请号： US592488申请日： 1996-01-26
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公开(公告)号： US5714050A公开(公告)日： 1998-02-03
- 发明人: Yoshinobu Akiba , Makoto Katsumata , Hitoshi Ushijima , Hidenori Yamanashi
- 申请人： Yoshinobu Akiba , Makoto Katsumata , Hitoshi Ushijima , Hidenori Yamanashi
- 申请人地址： JPX Tokyo
- 专利权人： Yazaki Corporation
- 当前专利权人： Yazaki Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-010514 19950126
- 主分类号： C25D1/00
- IPC分类号： C25D1/00 ; H05K1/00 ; H05K3/00 ; H05K3/20
摘要：
A method of producing a circuit board includes the steps of: electroplating a mold surface of a mold so that a circuit body made of a metal plating layer is formed on the mold surface of the mold; pressing the mold against a board made of a thermoplastic resin; heating and retaining the mold so that the circuit body is bonded to the board under heat and pressure; and releasing the mold from the board after cooling the board to thereby transfer the circuit body to the board. The circuit board may be in the shape of box with the circuit body on the inner surfaces thereof.
公开/授权文献
- US5147738A Nonaqueous electrolyte secondary battery 公开/授权日：1992-09-15
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