A high speed electrical plating apparatus employing a moving fluid and a tubular anode. The tubular anode contains pellets of the material being plated so as to make up for those utilized during the plating process. The electrodes are configured in such a way that the electrode need not be removed for servicing and also so that the pellets need not be serviced as frequently as with prior are constructions. In addition, the electrode is configured in such a way as to permit the pellets to shift as they dissolve without jamming and also to provide more uniform plating.