Invention Grant
US5727458A Method and apparatus for contour multi-level embossing with perforation bonding in selected spaced locations 失效
用于轮廓多级压花的方法和装置,在选定的间隔位置具有穿孔结合

Method and apparatus for contour multi-level embossing with perforation
bonding in selected spaced locations
Abstract:
An embossing apparatus and method which provides a better embossed appearance and eliminates undesired roughness on the backside of the web material. Two plies are multilevel embossed between rigid engraved rolls and backup rolls, which may be either engraved or smooth. One rigid roll has embossing elements of varying heights and perforation elements, which run in a side-by-side relationship with the corresponding perforation elements on the opposing rigid roll in a nip region of the apparatus. The multiple plies are perforation bonded between the perforation elements, which are preferably the two highest elements, thus reinforcing the other multi-level embossed pattern formed in between the perforation bonds. The embossed patterns impart a quilt-like contoured appearance to the finished product.
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