发明授权
US5727990A Method for mirror-polishing chamfered portion of wafer and
mirror-polishing apparatus
失效
用于镜面抛光的晶片倒角部分和镜面抛光装置的方法
- 专利标题： Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus
- 专利标题（中）： 用于镜面抛光的晶片倒角部分和镜面抛光装置的方法
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申请号： US779040申请日： 1997-01-06
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公开(公告)号： US5727990A公开(公告)日： 1998-03-17
- 发明人: Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
- 申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
- 申请人地址： JPX Tokyo JPX Nagano
- 专利权人： Shin-Etsu Handotai Co., Ltd.,Fujikoshi Machinery Corp.
- 当前专利权人： Shin-Etsu Handotai Co., Ltd.,Fujikoshi Machinery Corp.
- 当前专利权人地址： JPX Tokyo JPX Nagano
- 优先权： JPX6-159542 19940617
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B24B9/00 ; B24B9/06 ; B24B1/00 ; B24B7/24 ; B24B9/14
摘要：
A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.
公开/授权文献
- US5209736A Trocar method and apparatus 公开/授权日：1993-05-11
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