A hot-stamping foil including a metallic layer carried on flexible carrier layer, and having a layer of heat-activated adhesive on the underside of the metallic layer and a layer of a lacquer composition coating the upper surface of the metallic layer, the lacquer being a blend of at least 50% by weight, based on the total dry weight of the lacquer composition, of a copolymer of styrene and maleic anhydride (SMA copolymer) with at least one other acrylic copolymer selected from polymethylmethacrylate copolymers, polyacrylic acid copolymers and styrene/acrylic acid copolymers. Such lacquers have an improved heat resistance.