Invention Grant
- Patent Title: Insulation board composite
- Patent Title (中): 绝缘板复合材料
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Application No.: US831259Application Date: 1997-04-07
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Publication No.: US5737897APublication Date: 1998-04-14
- Inventor: Michael P. Naipawer, III
- Applicant: Michael P. Naipawer, III
- Applicant Address: NJ Wayne
- Assignee: Building Materials Corporation of America
- Current Assignee: Building Materials Corporation of America
- Current Assignee Address: NJ Wayne
- Main IPC: E04D11/02
- IPC: E04D11/02 ; E04D5/04
Abstract:
This invention relates to commercial roof assemblies applied over a flat roof deck, and, more particularly, to an insulation board composite capable of peel and stick application, in which the insulation board is mechanically attached to a roof deck, a release sheet is removed from the top face of the board (revealing the pressure sensitive adhesive layer), and a non-adhesive waterproofing membrane is then placed onto the adhesive face of the board.
Public/Granted literature
- US5210307A Catalytic reforming of alkyleneamines to linearly-extended polyalkylenepolyamines Public/Granted day:1993-05-11
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