Proposed is a novel heat-conductive sheet used for the transfer of heat from a heat-generating device, e.g., semiconductor devices, to a heat sink member mounted thereon by intervening therebetween. The heat-conductive sheet is a laminar body comprising an aluminum foil and a layer of a gel-like composite material consisting of a cured organopolysiloxane as the matrix phase and inorganic heat-conductive particles as the dispersed phase in the matrix. The gel-like heat-conductive layer is specified by a specific heat conductivity in the range from 0.001 to 0.005 calorie/cm.multidot.second.multidot..degree.C. and a specific consistency defined by the value of the 1/4-cone penetration in the range from 10 to 80 (.times.1/10 mm) at 25.degree. C. according to JIS K 2920.