发明授权
US5744379A Semiconductor device composed of plural semiconductor chips and coupling
means which couple the semiconductor chips together
失效
半导体器件由多个半导体芯片和将半导体芯片耦合在一起的耦合装置组成
- 专利标题： Semiconductor device composed of plural semiconductor chips and coupling means which couple the semiconductor chips together
- 专利标题（中）： 半导体器件由多个半导体芯片和将半导体芯片耦合在一起的耦合装置组成
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申请号： US491581申请日： 1995-06-06
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公开(公告)号： US5744379A公开(公告)日： 1998-04-28
- 发明人: Masaaki Mandai , Hitoshi Takeuchi , Yutaka Saito , Tomoyuki Yoshino
- 申请人： Masaaki Mandai , Hitoshi Takeuchi , Yutaka Saito , Tomoyuki Yoshino
- 申请人地址： JPX Tokyo
- 专利权人： Seiko Instruments, Inc.
- 当前专利权人： Seiko Instruments, Inc.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX4-108159 19920427; JPX4-284666 19921022; JPX4-297193 19921106; JPX4-299650 19921110; JPX5-29493 19930218
- 主分类号： H01L21/98
- IPC分类号： H01L21/98 ; H01L23/538 ; H01L25/18 ; H01L21/18
摘要：
The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image sensor chips 1 with each other, and the couple one semiconductor image sensor chip 1 to a driver substrate 3 which mounts thereon a semiconductor driving chip 2 for driving the semiconductor image sensor chips 1.
公开/授权文献
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