发明授权
US5753571A Lead and cadmium-free encapsulant composition 失效
无铅和无镉密封剂组合物

Lead and cadmium-free encapsulant composition
摘要:
A lead and cadmium-free encapsulant glass composition consisting essentially of by weight %, 60-80% Bi.sub.2 O.sub.3, 6-14% SiO.sub.2, 5-12% B.sub.2 O.sub.3, 5-10% Al.sub.2 O.sub.3 and 0-4% ZnO.
公开/授权文献
信息查询
0/0