Disclosed is a polyethylene resin composition for heavy-duty packaging bag, which has a specific MFR, a specific density and a specific melt tension and which comprises (I) a linear low-density polyethylene resin prepared from ethylene and an .alpha.-olefin of 4 or more carbon atoms and having a specific MFR, a specific molecular weight distribution and a density of 0.900 to 0.918 g/cm.sup.3, (II) a linear medium or high-density polyethylene resin having a density of 0.935 to 0.970 g/cm.sup.3 and (III) a high-pressure low-density polyethylene resin having a density of 0.915 to 0.924 g/cm.sup.3, in a specific ratio of components. Also disclosed is a polyethylene resin film prepared from said composition. The composition is able to provide a film which is excellent in low-temperature properties such as low-temperature drop-bag strength and can be advantageously used for a heavy-duty packaging bag even in a cold district of below-freezing temperature. The polyethylene resin film exerts the above-mentioned effects.