A pad-to-pad connection arrangement between adjacent electrical connectors, such as "bump-to-bump", "bump-to-hollow", or "bump-to-flat" pad arrangements, is achieved. Pads on the surface of an electrical connector may be selectively connected to conductive traces also on the surface of the electrical connector. When two adjacent electrical connectors are joined together in a side-by-side, adjacent relationship, the electrical pads along the side surfaces of the electrical connectors mate, thereby resulting in electrical connections being formed between mated pads of the electrical connectors. According to a preferred embodiment of the present invention, a flexible circuit containing the conductive traces and surface pads is formed about an electrical connector.