Invention Grant
- Patent Title: Semiconductor package and method thereof
- Patent Title (中): 半导体封装及其方法
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Application No.: US708296Application Date: 1996-09-04
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Publication No.: US5776798APublication Date: 1998-07-07
- Inventor: Son Ky Quan , Samuel L. Coffman , Bruce Reid , Keith E. Nelson , Deborah A. Hagen
- Applicant: Son Ky Quan , Samuel L. Coffman , Bruce Reid , Keith E. Nelson , Deborah A. Hagen
- Applicant Address: IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: IL Schaumburg
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L21/301 ; H01L21/56 ; H01L23/24 ; H01L23/31 ; H01L21/44
Abstract:
A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).
Public/Granted literature
- US5114175A Vehicle wheel suspension with quadrilateral link strut Public/Granted day:1992-05-19
Information query
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