- 专利标题: Method of processing semiconductor device with laser
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申请号: US462361申请日: 1995-06-05
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公开(公告)号: US5795795A公开(公告)日: 1998-08-18
- 发明人: Takamasa Kousai , Hongyong Zhang , Akiharu Miyanaga
- 申请人: Takamasa Kousai , Hongyong Zhang , Akiharu Miyanaga
- 申请人地址: JPX Kanagawa
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JPX Kanagawa
- 优先权: JPX6-309826 19941118
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/268 ; H01L21/324 ; H01L21/336 ; H01L21/77 ; H01L29/786 ; H01L21/306
摘要:
A method of fabricating a semiconductor device by the use of laser crystallization steps is provided. During these crystallization steps, an amorphous or polycrystalline semiconductor is crystallized by laser irradiation in such a way that generation of ridges is suppressed. Two separate laser crystallization steps are carried out. First, a laser irradiation step is performed in a vacuum, using somewhat weak laser light. Then, another laser irradiation step is performed in a vacuum, in the atmosphere, or in an oxygen ambient with intenser laser light. The first laser irradiation conducted in a vacuum does not result in satisfactory crystallization. However, this irradiation can suppress generation of ridges. The second laser irradiation step is performed in a vacuum, in the atmosphere, or in an oxygen ambient to achieve sufficient crystallization, but no ridges are produced.
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