发明授权
- 专利标题： Ceramic IC package base and ceramic cover
- 专利标题（中）： 陶瓷IC封装基座和陶瓷盖
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申请号： US976501申请日： 1997-11-24
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公开(公告)号： US5798566A公开(公告)日： 1998-08-25
- 发明人: Kazuhisa Sato , Masanori Kitou , Hisashi Wakako , Kazuo Kimura
- 申请人： Kazuhisa Sato , Masanori Kitou , Hisashi Wakako , Kazuo Kimura
- 申请人地址： JPX Nagoya
- 专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人地址： JPX Nagoya
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L23/373 ; H01L23/34 ; H01L23/06 ; H01L23/10 ; H01L23/15
摘要：
In accordance with the present invention, there is provided a ceramic IC package base which comprises a ceramic substrate, and a heat radiating member adhered to a side surface of the ceramic substrate and made of copper or copper alloy. The heat radiating member has an adhering portion at which it is adhered to the ceramic substrate. The adhering portion, when the heat radiating member is observed in a plan view, has one side which is equal to or larger than 8 mm. The adhering portion is of the thickness within the range from 0.25 mm to 0.76 mm. A ceramic IC package cover is also provided.