A surface acoustic wave (SAW) device in accordance with the present invention is constituted in such a way that a SAW device chip 2 in which electrode patterns are formed is accommodated within a package composed of a ceramic board 1 and a metallic cap 4. The SAW device comprises metallic patterns 5a and 5b provided at the ceramic board 1 as input/output terminals of the package and having convex portions 6a and 6b connected electrically to bonding pads 8a and 8b of a SAW device chip, respectively, and an elastic body 3 arranged between the metallic cap 4 and the SAW device chip 2. The SAW device chip 2 is fixed such that the bonding pads 8a and 8b are pushed against the convex portions 6a and 6b under a predetermined contact pressure by elastic force of the elastic body 3.