An electronic device includes an electronic component and a chassis to support the electronic component. The electronic device also includes a non-supporting chassis component that is integrally formed along with and as part of the chassis. The non-supporting chassis component is functionally operable in cooperation with the electronic component to enhance performance of the electronic component. In one example, the electronic component is an electronic speaker and the non-supporting chassis component is a resonance chamber positioned adjacent to the speaker to improve the speaker's sound qualities. The chassis and non-supporting chassis component (i.e., the resonance chamber) are integrally formed together via a single injection molding process using expanded polypropylene.