A manifold for a hot process injection molding apparatus includes a two piece manifold assembly. A first manifold section which includes a longitudinal melt channel and a nozzle drop to a mold is fixably secured to a manifold cavity of the apparatus. A second manifold section also including a longitudinal melt channel is sealably and slidably coupled with the first manifold section for fluidly communicating molding material from the second melt channel to the first melt channel. Expansion and contraction of the manifold sections are taken up by the slidable coupling.