发明授权
- 专利标题： Electronic circuit bonding interconnect component and flip chip interconnect bond
-
申请号： US853852申请日： 1997-05-09
-
公开(公告)号： US5804876A公开(公告)日： 1998-09-08
- 发明人: Rickie C. Lake , Mark E. Tuttle
- 申请人： Rickie C. Lake , Mark E. Tuttle
- 申请人地址： ID Boise
- 专利权人： Micron Communications Inc.
- 当前专利权人： Micron Communications Inc.
- 当前专利权人地址： ID Boise
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485 ; H05K3/32 ; H01L23/48
摘要：
An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bonding interconnect is used to bond a die pad to a supporting substrate thereby forming a surface mount device.
公开/授权文献
信息查询
IPC分类:
