A multi-layer electronic part, such as a multi-layer ceramic capacitor, which comprises internal electrodes stacked alternately with layers of a dielectric material containing at least 50 wt % of lead in terms of PbO and external electrodes connected to the internal electrodes, the external electrodes each comprising a baked electrode layer connected to the internal electrodes; a plating layer having solderability; and a metal particle-containing electrode layer comprising a thermosetting resin and metal particles, between the baked electrode layer and the plating layer, the metal particle-containing electrode layer having a thickness of from 5 to 200 .mu.m, the metal particle-containing electrode layer being disposed between the baked electrode layer and the plating layer.