A semi automatic film de-splicer that non-destructively separates film strips from splice tapes attached to the film strips with thermal adhesive. A reciprocating heat shoe is operated in two de-splicing cycles to press and heat the splice tape adhesive separately in each adhesive region of the tape. In the first cycle, in which one film strip is restricted from movement, the other film strip is placed in tension by a tensioning device mounted on the film strip holding roller. When the adhesive is softened and the heat shoe is released, the tensioned pulls the film strip free of the splice tape. The heat shoe then presses and reheats the free end of the splice tape against an underlying pickup web to tack the splice tape to the web. The web is then advanced to place the remaining adhesive region attaching the splice tape to the other film strip under the heat shoe and the other film holding roller is placed in tension. The heat shoe is then actuated in a second de-splicing cycle to press and heat the second adhesive region allowing the tensioned roller to pull the remaining film strip free of the splice tape when the heat is released. The web is then advanced to remove the tacked-on splice from the area of the heat shoe allowing a new film splice to be inserted into the de-splicer.