发明授权
- 专利标题： Applying adhesive to substrates
- 专利标题（中）： 将粘合剂涂在基材上
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申请号： US904007申请日： 1997-07-31
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公开(公告)号： US5807606A公开(公告)日： 1998-09-15
- 发明人: Douglas K. Mould , Joseph Renda, Jr. , Steven W. Hall
- 申请人： Douglas K. Mould , Joseph Renda, Jr. , Steven W. Hall
- 申请人地址： MA Franklin
- 专利权人： MPM Corporation
- 当前专利权人： MPM Corporation
- 当前专利权人地址： MA Franklin
- 主分类号： B05C11/10
- IPC分类号： B05C11/10 ; H05K1/02 ; H05K3/12 ; H05K3/30 ; B05D1/36
摘要：
Applying adhesive in a desired pattern on a substrate by determining one or more inspection sites for monitoring adhesive deposition, applying adhesive to a substrate with a stencil or screen printer, viewing the inspection sites with a camera that generates image signals, and processing the image signals to determine if adhesive has been properly applied at the inspection sites.
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