发明授权
US5830041A Method and apparatus for determining endpoint during a polishing process
失效
用于在抛光过程中确定端点的方法和装置
- 专利标题： Method and apparatus for determining endpoint during a polishing process
- 专利标题（中）： 用于在抛光过程中确定端点的方法和装置
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申请号： US743361申请日： 1996-11-04
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公开(公告)号： US5830041A公开(公告)日： 1998-11-03
- 发明人: Tamami Takahashi , Fumihiko Sakata , Norio Kimura , Masako Kodera , Atsushi Shigeta
- 申请人： Tamami Takahashi , Fumihiko Sakata , Norio Kimura , Masako Kodera , Atsushi Shigeta
- 申请人地址： JPX Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-309982 19951102
- 主分类号： B24B37/013
- IPC分类号： B24B37/013 ; B24B37/04 ; B24B49/16 ; B24B7/22
摘要：
A method and apparatus for determining a planar end point on a workpiece such as a semiconductor wafer in a polishing process for polishing the workpiece to a flat mirror finish. The workpiece having an uneven surface is held by a top ring and pressed against a polishing platen. The workpiece is moved relative to the polishing platen to polish the workpiece, and a change in a frictional force between the workpiece and the polishing platen is detected. A reference time when the workpiece having an uneven surface is polished to a flat surface is determined based on the change of the frictional force between the workpiece and the polishing platen. The time when a certain period of polishing time from the reference time elapses is determined as an endpoint on the workpiece.
公开/授权文献
- US5182695A Ceramic composition and electronic part using the same 公开/授权日：1993-01-26
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