Invention Grant
- Patent Title: Sputtering target protection device
- Patent Title (中): 溅射目标保护装置
-
Application No.: US856462Application Date: 1997-05-14
-
Publication No.: US5846389APublication Date: 1998-12-08
- Inventor: Howard H. Levine , Neil J. Sullivan , Paul S. Gilman
- Applicant: Howard H. Levine , Neil J. Sullivan , Paul S. Gilman
- Applicant Address: JPX Tokyo NY Orangeburg
- Assignee: Sony Corporation,Materials Research Corporation
- Current Assignee: Sony Corporation,Materials Research Corporation
- Current Assignee Address: JPX Tokyo NY Orangeburg
- Main IPC: C23C14/34
- IPC: C23C14/34
Abstract:
A sputtering target protection device for covering and protecting the precisely machined and engineered surface of a sputtering target assembly during shipment, intermediate handling and installation of the target assembly. The protection device includes a top wall preferably having the same general circumferential configuration as the top surface of the target, and an integral skirt which depends from the top wall. The depending skirt is adapted to frictionally engage a side surface of the sputtering target while the top wall of the protection device is spaced from the sputtering surface to cover and protect the surface during shipment and installation of the target assembly. The protection device is designed to be single-use and disposable. Methods are also disclosed.
Public/Granted literature
- US5248251A Graded palladium-containing partial combustion catalyst and a process for using it Public/Granted day:1993-09-28
Information query
IPC分类: