Invention Grant
- Patent Title: Method and device for interconnecting integrated circuits in three dimensions
- Patent Title (中): 三维集成电路互连的方法和装置
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Application No.: US749660Application Date: 1996-11-15
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Publication No.: US5847448APublication Date: 1998-12-08
- Inventor: Christian Val , Michel Leroy
- Applicant: Christian Val , Michel Leroy
- Applicant Address: FRX Paris
- Assignee: Thomson-CSF
- Current Assignee: Thomson-CSF
- Current Assignee Address: FRX Paris
- Priority: FRX9015473 19901211
- Main IPC: H01L21/98
- IPC: H01L21/98 ; H01L25/065 ; H01L23/02 ; H01L23/34
Abstract:
A method and device for interconnecting stacked semiconducting plates, in which each of the plates has an integrated circuit. The semiconducting plates (P) are stacked and made solid with each other. In one embodiment, their connecting contacts are connected by a wire (F) to any one of the faces of the stack except one (B), which is to be in contact with a printed circuit. Connections of the plates together and with the printed circuit is made on the faces (F.sub.V, F.sub.S, F.sub.L) of the stack.
Public/Granted literature
- US5207305A Method and apparatus for incorporating hydrodynamic film to transfer or retard motion and dissipate heat Public/Granted day:1993-05-04
Information query
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