发明授权
US5849625A Planar field oxide isolation process for semiconductor integrated circuit devices using liquid phase deposition 失效
使用液相沉积的半导体集成电路器件的平面场氧化物隔离工艺

Planar field oxide isolation process for semiconductor integrated
circuit devices using liquid phase deposition
摘要:
A process for fabricating an improved planar field oxide (FOX) structure on a silicon substrate was achieved. The process involves forming recessed areas in the silicon substrate where the field oxide is require. A thin silicon oxide is formed on the surface of the recessed areas as a nucleation layer and then a thicker silicon oxide layer is selectively deposited in the recess areas by Liquid Phase Deposition (LPD). The planar FOX structure formed by LPD can be used in conjunction with a FOX structure formed by the conventional LOCal Oxidation of Silicon (LOCOS) process on the same substrate. The planar field oxide formed by LPD eliminates the bird beak structure and the lateral diffusion of the channel stop implant commonly associated with the LOCOS structure.
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