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发明授权
US5849826A Semiaromatic polyamides, processes for preparing the same and compositions containing the same 失效
半芳族聚酰胺，其制备方法和含有它们的组合物

Semiaromatic polyamides, processes for preparing the same and compositions containing the same
摘要：
The semiaromatic polyamide of the invention comprises 40 to 90% by mol of (A) recurring units derived from terephthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 50% by mol of (B) recurring units derived from isophthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 60% by mol of (C) recurring units derived from an aliphatic dicarboxylic acid of 4 to 18 carbon atoms and an aliphatic diamine of 4 to 12 carbon atoms and 0 to 50% by mol of (D) recurring units derived from a lactam or an aminocarboxylic acid of 6 to 20 carbon atoms, and has a content of boiling water-soluble components (MO components) of not more than 0.25% by weight. The semiaromatic polyamide has a low content of the MO components, so that mold contamination hardly brought about in the molding process, and also molded articles of good heat resistance can be produced.
摘要（中）：

PCT No.PCT / JP96 / 03107 Sec。 371日期：1997年6月25日 102（e）日期1996年6月25日PCT 1996年10月24日PCT公布。 公开号WO97 / 15610PC 日本1997年5月1日本发明的半芳族聚酰胺包含40〜90摩尔％的（A）来自对苯二甲酸和4〜12个碳原子的脂肪族二胺的重复单元，（B）重复单元0〜50摩尔％ 衍生自间苯二甲酸和4〜12个碳原子的脂族二胺，0〜60摩尔％的（C）碳原子数4〜18的脂肪族二羧酸的重复单元和4〜12个碳原子的脂肪族二胺， 0〜50摩尔％的（D）来自内酰胺或6〜20个碳原子的氨基羧酸的重复单元，沸水溶性成分（MO成分）的含量为0.25重量％以下。 半芳族聚酰胺的MO成分含量低，因此在成型过程中几乎不产生模具污染，并且还可以制造耐热性良好的成型品。

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