发明授权
US5869356A Method and structure for constraining the flow of incapsulant applied to
an I/C chip on a substrate
失效
限制施加到基板上的I / C芯片的密封剂的流动的方法和结构
- 专利标题： Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate
- 专利标题（中）： 限制施加到基板上的I / C芯片的密封剂的流动的方法和结构
-
申请号： US42875申请日： 1998-03-17
-
公开(公告)号： US5869356A公开(公告)日： 1999-02-09
- 发明人: James W. Fuller, Jr. , Mary Beth Fletcher , Joseph Alphonse Kotylo , Jeffrey Alan Knight , David Michael Passante , Allen F. Moring
- 申请人： James W. Fuller, Jr. , Mary Beth Fletcher , Joseph Alphonse Kotylo , Jeffrey Alan Knight , David Michael Passante , Allen F. Moring
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/24 ; H01L23/31
摘要：
According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.
公开/授权文献
- USD380119S Exercise towel 公开/授权日：1997-06-24