A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards. The rails of the dual track system are advantageously moveable to allow for variable width boards or operation of the system in single track mode. The stencil system design may be adapted to make the dual track system a recirculating track, capable of supporting pallets for transport and printing of delicate materials. In addition, the stencil system design may be adapted for processing boards in parallel, where the boards are received simultaneously or staggered, placed at a stencil position, and printed with one stroke of the squeegee head.