发明授权
- 专利标题: Composite backing plate for a sputtering target
- 专利标题(中): 用于溅射靶的复合背板
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申请号: US608857申请日: 1996-02-29
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公开(公告)号: US5879524A公开(公告)日: 1999-03-09
- 发明人: Steven Hurwitt , Ira Reiss
- 申请人: Steven Hurwitt , Ira Reiss
- 申请人地址: JPX Tokyo NY Orangeburg
- 专利权人: Sony Corporation,Marerials Research Corporation
- 当前专利权人: Sony Corporation,Marerials Research Corporation
- 当前专利权人地址: JPX Tokyo NY Orangeburg
- 主分类号: C23C14/34
- IPC分类号: C23C14/34 ; H01J37/34
摘要:
A composite backing plate (34) for a backing plate-target assembly (41) having a core of structural material (36) with a front face (42) and/or a rear face (44) of a different material laminated thereto. The composite backing plate (35) has the desired mechanical properties of a solid copper backing plate, for example, strength and stiffness, but is preferably less than half the density of a solid copper backing plate. The core material is preferably aluminum; the front face is preferably copper; and the rear face is preferably either copper or an organic material.
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