An electrical interconnect for electrically connecting a magnetic head and read/write circuitry in a disc drive includes a dielectric substrate, a first conductive trace layer deposited upon the substrate, a dielectric layer deposited upon at least a portion of the first conductive trace layer and a second conductive trace layer deposited upon the dielectric layer. The first and second conductive trace layers have ends configured for being electrically coupled to the magnetic head and the read/write circuitry. The first and second conductive trace layers at least partially overlap one another and are sufficiently proximate to one another to reduce inductance of the interconnect.