It is the object of the invention to provide a semiconductor acceleration sensor, in which the characteristic is stable, even if minute spherical particle intrudes into the clearance of the sensor, and a yielding rate and a reliability are remarkably improved. The upper and lower surfaces of a sensor chip, which is composed of a weight portion and beams supporting it, are put between the upper and lower stopper substrates. The surfaces of the upper and lower substrates, which face the sensor chip, have engraved areas thereon, and are stuck to the aforementioned sensor chip via adhesive portions. The adhesive portion is filled with a mixture of adhesive agent and minute spherical hard plastics particle with a equal diameter. The width clearance between sensor chip and stopper substrate is determined by the diameter of the minute spherical particle made of hard plastics.