发明授权
US5897337A Process for adhesively bonding a semiconductor chip to a carrier film
失效
将半导体芯片粘合到载体膜上的工艺
- 专利标题： Process for adhesively bonding a semiconductor chip to a carrier film
- 专利标题（中）： 将半导体芯片粘合到载体膜上的工艺
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申请号： US533205申请日： 1995-09-25
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公开(公告)号： US5897337A公开(公告)日： 1999-04-27
- 发明人: Keiichiro Kata , Shuichi Matsuda
- 申请人： Keiichiro Kata , Shuichi Matsuda
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-238040 19940930
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/56 ; H01L23/31 ; H01L23/485 ; H01L23/495 ; H01L21/283 ; H01L21/58
摘要：
In a method of manufacturing a semiconductor device comprising a semiconductor chip and a carrier film which includes an insulating film and wiring patterns formed on one of main surfaces of the insulating film, an adhesive layer is formed on a surface of a semiconductor wafer having a number of integrated circuits. Each of the integrated circuits has electrode pads for external connection on the foregoing surface of the semiconductor wafer. Subsequently, openings are formed at regions of the adhesive layer corresponding to the electrode pads, and then, the semiconductor wafer is cut per integrated circuit so as to obtain the semiconductor chips. Thereafter, the electrode pads of the semiconductor chip and the wiring patterns of the carrier film are connected to each other through the corresponding openings of the adhesive layer, respectively. Then, the semiconductor chip and the carrier film are bonded together via the adhesive layer interposed therebetween. It may be arranged that the adhesive layer is formed on the carrier film rather than on the semiconductor chip.
公开/授权文献
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