An edge clip is disclosed for electrically connecting a conductive pad on the surface of a printed circuit board or its edge to an external connector. The edge clip is substantially U-shaped, with first and second opposing, non-parallel sides defining a space therebetween. For connection, the printed circuit board edge is fitted into the space such that the opposing sides provide spring-like deflective force against the pad and the printed circuit board, thereby providing a more reliable connection. The edge clip may include an alignment feature for facilitating alignment prior to soldering. The alignment feature may include small projections formed on the edge clip to align with, and fit into, holes on the print circuit board. Scored sections may be disposed on one edge of the clip to facilitate removal of the edge clip from a carrier during assembly. Further, the edge clip may include a center beam extending away from one of the opposing surfaces to provide contact with another metallic surface, such as a miniature card case, thereby providing additional grounding capabilities which can provide protection against static discharge.