Invention Grant
- Patent Title: Laminate organic resin wiring board and method of producing the same
- Patent Title (中): 层压有机树脂布线板及其制造方法
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Application No.: US662005Application Date: 1996-06-12
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Publication No.: US5909009APublication Date: 1999-06-01
- Inventor: Shinji Tanaka
- Applicant: Shinji Tanaka
- Applicant Address: JPX Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JPX Tokyo
- Priority: JPX7-146643 19950614
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L23/538 ; H05K1/09 ; H05K3/00 ; H05K3/46 ; H05K1/14
Abstract:
A laminate organic resin wiring board and a method of producing the same are disclosed. The wiring board has a plurality of subassemblies each having a conductive resin layer serving as a ground or feed layer on its top. The subassemblies are adhered to each other at their conductive resin layers. This successfully eliminates the need for an organic resin layer for insulation customarily formed on the top of the individual subassembly. The decrease in the number of layers reduces the period of time necessary for the production of the wiring board.
Public/Granted literature
- US5246838A Processing of proteins Public/Granted day:1993-09-21
Information query
IPC分类:
