发明授权
- 专利标题： Laminate organic resin wiring board and method of producing the same
- 专利标题（中）： 层压有机树脂布线板及其制造方法
-
申请号： US662005申请日： 1996-06-12
-
公开(公告)号： US5909009A公开(公告)日： 1999-06-01
- 发明人: Shinji Tanaka
- 申请人： Shinji Tanaka
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-146643 19950614
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L23/538 ; H05K1/09 ; H05K3/00 ; H05K3/46 ; H05K1/14
摘要：
A laminate organic resin wiring board and a method of producing the same are disclosed. The wiring board has a plurality of subassemblies each having a conductive resin layer serving as a ground or feed layer on its top. The subassemblies are adhered to each other at their conductive resin layers. This successfully eliminates the need for an organic resin layer for insulation customarily formed on the top of the individual subassembly. The decrease in the number of layers reduces the period of time necessary for the production of the wiring board.
公开/授权文献
- US5246838A Processing of proteins 公开/授权日：1993-09-21
信息查询
IPC分类:
