Invention Grant
US5913819A Injection molded, heat-sealed housing and half-etched lead frame for
oximeter sensor
失效
注塑，热密封外壳和用于血氧计传感器的半蚀刻引线框架
- Patent Title: Injection molded, heat-sealed housing and half-etched lead frame for oximeter sensor
- Patent Title (中): 注塑，热密封外壳和用于血氧计传感器的半蚀刻引线框架
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Application No.: US826698Application Date: 1997-04-07
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Publication No.: US5913819APublication Date: 1999-06-22
- Inventor: James H. Taylor , Daniel A. Estoque , Kirk L. Weimer
- Applicant: James H. Taylor , Daniel A. Estoque , Kirk L. Weimer
- Applicant Address: CO Louisville
- Assignee: Datex-Ohmeda, Inc.
- Current Assignee: Datex-Ohmeda, Inc.
- Current Assignee Address: CO Louisville
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A61B19/08 ; H05K3/30
Abstract:
The present invention is directed to an oximeter sensor to measure the oxygen content of a patient's blood. The sensor can include a lead frame having different thicknesses, a sensor housing being molded from a common thermoplastic resin, and rib members in the housing for inhibiting shorting between adjacent traces of the lead frame. The present invention further includes a process for forming the sensor.
Public/Granted literature
- US4721637A Highly oriented resin-made reinforcing member Public/Granted day:1988-01-26
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