发明授权
US5914834A Head suspension assembly with electrical interconnect by slider bond
pads and gimbal bonding zones
失效
头悬挂组件，通过滑块连接焊盘和万向节粘结区域进行电气互连
- 专利标题： Head suspension assembly with electrical interconnect by slider bond pads and gimbal bonding zones
- 专利标题（中）： 头悬挂组件，通过滑块连接焊盘和万向节粘结区域进行电气互连
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申请号： US902865申请日： 1997-07-30
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公开(公告)号： US5914834A公开(公告)日： 1999-06-22
- 发明人: Gary E. Gustafson
- 申请人： Gary E. Gustafson
- 申请人地址： MN Hutchinson
- 专利权人： Hutchinson Technology, Inc.
- 当前专利权人： Hutchinson Technology, Inc.
- 当前专利权人地址： MN Hutchinson
- 主分类号： G11B5/48
- IPC分类号： G11B5/48 ; G11B5/60
摘要：
A head gimbal assembly allows a simplified, automatable electrical interconnection from the read/write head slider to the head suspension assembly electrical interconnect. The head suspension assembly is constructed as a laminated structure. Using a read/write head slider with electrical bond pads on an upper horizontal surface (i.e, the head slider surface bonded to the head suspension assembly and opposite to the disk-confronting head slider surface), electrical interconnection to bonding zones on the upper horizontal surface of the gimbal region is established using standard automated or semi-automated wire bond tooling technology.
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