发明授权
- 专利标题： Method for the cleaning and direct bonding of solids
- 专利标题（中）： 清洁和直接粘结固体的方法
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申请号： US444035申请日： 1995-05-18
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公开(公告)号： US5915193A公开(公告)日： 1999-06-22
- 发明人: Qin-Yi Tong , Ulrich Goesele , Ling Tong
- 申请人： Qin-Yi Tong , Ulrich Goesele , Ling Tong
- 专利权人： Tong; Qin-Yi,Goesele; Ulrich,Tong; Ling
- 当前专利权人： Tong; Qin-Yi,Goesele; Ulrich,Tong; Ling
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; H01L21/304
摘要：
Cleaning in periodic acid (H.sub.5 IO.sub.6) aqueous solutions (HI solutions) of particular compositions removes thermally unstable hydrocarbons from the surfaces of semiconductor wafers and enables the direct bonding of semiconductor surfaces such that the bonded interface between these surfaces remains free of bubbles even after heating subsequent to bonding.
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