An electronic circuit module having a metal cover is provided for interconnecting with a host device. The module includes an interface whereby electronic signals can be exchanged between the module and the host device. A mechanism for electrically grounding the metal cover to the ground plane of a printed circuit board housed within the module is provided along with a device for connecting the ground plane of the printed circuit board to a signal reference ground potential supplied by the host device. The present invention includes a module frame for attaching the metal cover thereto. A printed circuit board, including a ground plane, is mounted within the frame. A connector having a plurality of contact elements electrically connected to various the circuits disposed on the printed circuit board, including at least one contact element electrically connected to the ground plane is also adapted to fit within the module frame. The connector includes at least one grounding member. The grounding member forms an electrical connection with one of the contact elements of the connector which is electrically connected to the ground plane of the printed circuit board. With the module fully assembled, the grounding member engages the metal cover, thereby forming a ground path between said cover and the ground plane. The contact element connected to the ground plane of the printed circuit board is positioned within the connector to receive the ground pin of a mating connector located on the host device.