A process for obtaining a lift-off imaging profile which comprises the steps of:a) providing a first layer of plasma etchable material wherein said material has a film thickness less than about 0.5 .mu.m (micrometer);b) providing a second layer comprising a photoimageable material on top of the first layer;c) forming a pattern in said second layer which comprises the steps of selectively exposing and developing the second layer;d) reacting the second layer with an organosilicon material; ande) etching the first layer isotropically in an oxygen atmosphere.