发明授权
- 专利标题： Chip-type composite part
- 专利标题（中）： 芯片型复合件
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申请号： US106144申请日： 1993-08-13
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公开(公告)号： US5928766A公开(公告)日： 1999-07-27
- 发明人: Toshihiro Hanamura
- 申请人： Toshihiro Hanamura
- 申请人地址： JPX Kyoto
- 专利权人： Rohm Co., Ltd.
- 当前专利权人： Rohm Co., Ltd.
- 当前专利权人地址： JPX Kyoto
- 优先权： JPX3-312961 19911128
- 主分类号： H01C7/00
- IPC分类号： H01C7/00 ; H01C13/00 ; H01G4/40 ; H03H1/02 ; B32B3/00
摘要：
On the front surface of an insulating substrate, there are formed first and second terminal electrodes at one end portion of the substrate, a third terminal electrode at the other end portion, a resistor portion connected to the first and second terminal electrodes, and a capacitor portion connected to the second and third terminal electrodes. The capacitor portion has a multilayer structure consisting of a bottom electrode, dielectric layer and a top electrode.