发明授权
- 专利标题： Semiconductor device and heat sink used therein
- 专利标题（中）： 其中使用的半导体器件和散热器
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申请号： US886013申请日： 1997-06-30
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公开(公告)号： US5929513A公开(公告)日： 1999-07-27
- 发明人: Yuichi Asano , Akihiro Kubota , Koichi Sibasaki , Kazuhiro Yonetake , Tsuyoshi Aoki
- 申请人： Yuichi Asano , Akihiro Kubota , Koichi Sibasaki , Kazuhiro Yonetake , Tsuyoshi Aoki
- 申请人地址： JPX Kanagawa
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kanagawa
- 优先权： JPX6-192538 19940816; JPX6-303958 19941207
- 主分类号： H01L23/433
- IPC分类号： H01L23/433 ; H01L23/495 ; H01L23/28 ; H01L23/10
摘要：
The present invention relates to a semiconductor device in which inner leads of a lead frame are electrically connected to a semiconductor chip, a method for producing thereof and a lead frame used therein. The object of the present invention is to improve a strength of the lead frame and a heat release efficiency in a small-size multi-pin type semiconductor device. In the inner lead of the lead frame, a thin plate portion is formed. The thin plate portions are secured on a heat spreader. A semiconductor chip is mounted on the heat spreader. The semiconductor chip is bonded to the thin plate portions of the inner leads through wires.
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