发明授权
US5930651A Method of forming a semiconductor device having a plurality of cavity defined gating regions 失效
形成具有多个空腔限定的门控区域的半导体器件的方法

Method of forming a semiconductor device having a plurality of cavity
defined gating regions
摘要:
A P.sup.+ layer is formed on the lower surface of an N.sup.- substrate, and recesses are defined in the upper surface of the N.sup.- substrate. Then, P.sup.+ gate regions and bottom gate regions are formed in side walls and bottoms of the recesses. The N.sup.- substrate and an N.sup.- substrate are ultrasonically cleaned to remove impurities therefrom, then cleaned by pure water, and dried by a spinner. Then, while lands on the upper surface of the N.sup.- substrate are being held against the surface of the N.sup.- substrate, the N.sup.- substrates are joined to each other by heating them at 800.degree. C. in a hydrogen atmosphere.
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