发明授权
- 专利标题： Wide frequency band transition between via RF transmission lines and planar transmission lines
- 专利标题（中）： 通过RF传输线和平面传输线之间的宽频带过渡
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申请号： US985750申请日： 1997-12-05
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公开(公告)号： US5930665A公开(公告)日： 1999-07-27
- 发明人: Ching-Fai Cho , Helmut Carl Maiershofer , Do Bum Shin , Avery Yee Quil
- 申请人： Ching-Fai Cho , Helmut Carl Maiershofer , Do Bum Shin , Avery Yee Quil
- 申请人地址： NY White Plains
- 专利权人： ITT Industries, Inc.
- 当前专利权人： ITT Industries, Inc.
- 当前专利权人地址： NY White Plains
- 主分类号： H01L23/66
- IPC分类号： H01L23/66 ; H01P1/04 ; H05K3/46 ; H01L21/44
摘要：
A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.
信息查询
IPC分类:
