发明授权
US5931222A Adhesion promoting layer for bonding polymeric adhesive to metal and a
heat sink assembly using same
失效
用于将聚合物粘合剂粘合到金属上的粘合促进层和使用其的散热器组件
- 专利标题： Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same
- 专利标题（中）： 用于将聚合物粘合剂粘合到金属上的粘合促进层和使用其的散热器组件
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申请号： US910547申请日： 1997-07-30
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公开(公告)号： US5931222A公开(公告)日： 1999-08-03
- 发明人: Hilton T. Toy , David L. Edwards , Da-Yuan Shih , Ajay P. Giri
- 申请人： Hilton T. Toy , David L. Edwards , Da-Yuan Shih , Ajay P. Giri
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Coporation
- 当前专利权人： International Business Machines Coporation
- 当前专利权人地址： NY Armonk
- 主分类号： F28F3/02
- IPC分类号： F28F3/02 ; F28F7/00
摘要：
A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.
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